Wearable Tech World Feature Article
April 01, 2015

As Semicon Fabs Eye Solutions for Moore's Law Extension, Pibond Introduces a New Product Line for Logic, Memory, Power and MEMS Devices

HELSINKI, Finland, April 1, 2015 /PRNewswire/ -- Pibond Oy, a specialty chemical manufacturer of advanced semiconductor solutions, today introduced its new product line of liquid spin-on metal oxide hardmask materials. Targeting 10nm node semiconductor processing, 3D NAND, power ICs as well as MEMS applications, this technology enables advanced device manufacturing through reduced cost of ownership (COO) and simplified processing.

With the ever-increasing demand for increased functionality in applications from personal computing to mobile to cloud storage to wearables, the semiconductor industry is targeting smaller and smaller nodes and in so doing has lived up to Gordon Moore's prediction. However, the limits of current lithography processes and the uncertainty surrounding next generation approaches, compounded by their costs, have cast doubt on whether Moore's law has finally run 'out of steam.'

Pibond's breakthrough materials are designed to bridge this gap, providing continuity for existing high-end fabs, while maintaining compatibility for future technology roadmaps. These novel polymers represent the next generation of liquid spin-on hard mask products and are suitable for advanced lithographic patterning, 2.5/3D-IC packaging, as well as MEMS processing.

SAP-100 Product Line: A new solution for advanced lithography patterning of logic and power devices and high selectivity etching for 3D NAND and MEMS 

Pibond's SAP 100 product line is based on patent pending organo-siloxane modified spin-on metal oxide thin films that are compatible with advanced photorsist lithography and other semiconductor etch processes. The product line offers tunable optical (n&k) properties matching critical requirements of advanced lithography. Furthermore, it shows extraordinary etch resistance in plasma etching processes even at very low film thicknesses. Unlike most conventional hard masks, the Pibond SAP hard mask is applied with low cost spin-on track equipment, enabling high throughput and lowering the overall COO. Importantly, it can be applied with process equipment common in both state-of-the-art and legacy fabs, thus eliminating the need for new and potentially capital-intensive equipment. Future product releases in the SAP-100 family will be directly photopatternable further decreasing process complexity and COO.  

"As process throughput and the demand for ever increasing device performance continue to challenge the semiconductor industry, we are happy to announce this new class of products based on advanced metal oxide and siloxane polymers. Capable of extending the runway for existing lithography tools and processes, thereby lowering the operating costs of current and future fabs, they are also paving the way for the future as new technologies like EUV mature," said Jonathan Glen, Chairman of Pibond. "As the industry demands new materials to meet the needs of EUV lithography, 3D memory, power ICs, image sensors, TSV and MEMS applications, Pibond is well placed to be a driving force in this transition."

About Pibond

Pibond is a leader in the development and production of advanced liquid spin-on materials. With the acquisition of Silecs technology and state-of-the-art production plant, Pibond has a proven track record of materials innovation and manufacturing for the semiconductor industry. Pibond products are key contributors in the production of the latest ultra-high resolution semiconductor devices used in mobile devices, electric vehicles and wearables. A global provider with a proven and audited track record of producing and monitoring specialty chemicals at ultra-high purity levels (e.g. impurities are at parts-per-trillion levels), Pibond's Helsinki facility meets the standards for reliability and high quality demanded by the semiconductor industry. Please visit us at www.silecs.com.

Contact
Pibond Oy
Kutojantie 2 B
02630 Espoo, Finland
Info@silecs.com

To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/as-semicon-fabs-eye-solutions-for-moores-law-extension-pibond-introduces-a-new-product-line-for-logic-memory-power-and-mems-devices-300059106.html

SOURCE Pibond




Edited by Stefania Viscusi




Comments powered by Disqus


Featured Video

Dedicated to Wearable Tech: Mobile, Sports, Fitness, Audio, Fashion, Design


Featured Podcasts

The Business of Wearable Computing: An Interview with Brand Finance An interview with Edgar Baum, Managing Director North America with Brand Finance, the world’s leading brand valuation and strategy consultancy. Mr. Baum specializes in marketing ROI and financially quantified brand strategy.
Getting Attention for Your Wearables Joe Daniels of Loeb & Loeb discusses how wearable tech entrepreneurs can gain exposure for their ideas and what to do once they've won attention from potential investors.
Wearable Success Rides on Actionable Intelligence Lux Capital's Adam Goulburn focuses on the traits sought by investors as they consider wearable startups, such as how well their software turns collected data into actionable intelligence.
Wearable Tech Startup Strategy CRV's George Zachary talks wearable startups and how they can secure the attention of the right investors as the seek to become the next great thing in wearables.
How to Win the Wearable Tech Funding Game Donatella Giacometti speaks with Canary Ventures' Alex Goldberg about what the investment community looks for in startups, such as the many new wearable tech companies that are emerging.

Wearable Tech World Media Sponsors